Tuesday, May 14, 2024

SAIL Rourkela Steel Plant and NIT, Rourkela sign MoU for promoting Joint Research & Development Projects

Rourkela : Furthering the cause of industry-academia interface so as to catalyze innovation and growth in technology, a Memorandum of Understanding (MoU) was signed between SAIL, Rourkela Steel Plant (RSP) and National Institute of Technology (NIT), Rourkela on 1st February 2023.
Mr. S R Suryawanshi, ED(Works) and Prof. K. Umamaheshwar Rao, Director, NIT, Rourkela signed the document on behalf of their respective organisations, in a ceremony organised at the Office of ED(Works) of RSP. Many senior officers of RSP as well as the Registrar and Professors of NIT were present on the occasion.
Speaking on the occasion, Mr. Suryawanshi said, “With this MoU, RSP shall gain work-ready talent with specialist knowledge and practical training, and NIT shall benefit by having opportunities to work on relevant technologies and challenging problems. This industry-academia collaboration shall be a defining moment for the progress of both these elite institutions and shall contribute handsomely to the vision of a Digital India.”
Expressing his happiness over inking of the MoU, Prof. K. Umamaheshwar Rao said that although RSP and NIT used to have many collaborative projects earlier, this new partnership will be instrumental in further advancing research and creating a skilled workforce. “Let the combination yield major breakthroughs in research and innovation and become an example for others,” he said. Mr. S. Pal Chowdhury, CGM (Automation & Instrumentation) proposed a vote of thanks.
It is worth mentioning here that the objective of the MoU is to pursue joint research & development projects leading to publications, patents, copyrights etc. The projects will focus on areas like Coke and Sinter Production, Raw Material Handing and Processing, Steel Production, New Process Development, Safety, Improvement in the Quality, Energy Conservation, Environment Control, trouble shoot technical problems and Digital Transformation relevant to RSP.
Another major aspect of the MoU is the setting up of an advanced PCB (Printed Circuit Board) testing facility at NIT Rourkela that will be used for training and skill development for local underprivileged youth of RSP’s peripheral areas and direct impact zones to provide better opportunities for employment.

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